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HLMP-HB55/HLMP-HM55/ HLMP-HB54/HLMP-HM54
5 mm Precision Optical Performance InGaN Oval LED Lamps
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Indium Gallium Nitride for Blue and Green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long term exposure to direct sunlight. These lamps are available in two package options (standoff and without standoff) to give designer flexibility with device mounting.
Features
* Well-defined spatial radiation pattern * High brightness material - Blue InGaN 470 nm - Green InGaN 525 nm
Applications
* Full color signs * Commercial outdoor advertising
Benefits
* Viewing angle designed for wide field of view applications * Superior performance for outdoor environments
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Drawing A
NOTE: MEASURED JUST ABOVE FLANGE. 1.50 MAX. (0.059) 3.80 (0.150) 0.70 MAX. 0.50 0.10 (0.019 0.003)
5.20 (0.204) CATHODE LEAD
2.54 (0.10)
1.00 MIN. (0.039)
7.00 (0.275)
25.00 MIN. (0.984)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE 0.25 mm UNLESS OTHERWISE NOTED.
Package Drawing B
NOTE: MEASURED JUST ABOVE FLANGE. 10.85 0.50 (0.427 0.019) 1.20 (0.047) 0.50 0.10 (0.019 0.003) 3.80 (0.150)
5.20 (0.204) CATHODE LEAD
2.54 (0.10)
1.50 MAX. (0.059) 7.00 (0.275)
1.00 MIN. (0.039)
25.00 MIN. (0.984)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE 0.25 mm UNLESS OTHERWISE NOTED.
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Device Selection Guide
Color and Dominant Wavelength d (nm) Typ. Blue 470 Blue 470 Blue 470 Green 525 Green 525 Green 525 Green 525 Luminous Intensity Iv (mcd) at 20 mA Min. 110 180 240 520 520 680 880 Luminous Intensity Iv (mcd) at 20 mA Max. 310 310 400 1500 1500 1150 1500
Part Number HLMP-HB54-FJ0XX HLMP-HB55-HJCxx HLMP-HB55-JKCxx HLMP-HM54-MQ0xx HLMP-HM55-MQ0xx HLMP-HM55-NPCxx HLMP-HM55-PQCxx
Leads with Standoff No Yes Yes No Yes Yes Yes
Package Drawing A B B A B B B
Tinting Type Blue Blue Blue Green Green Green Green
Notes: 1 The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the Chromaticity Diagram and represents the color of the lamp.
Part Numbering System
HLMP-X X XX - X X X XX Mechanical Options 00: Bulk Packaging DD: Ammo Pack Color Bin Selections 0: No color bin limitation Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue M: 525 nm Green Package H: 5 mm Oval 40 x 100
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Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current[1] Current[2] Peak Pulsed Forward Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Derate linearly as shown in Figure 3. 2. Duty factor 10%, Frequency 1kHz
Value 30 mA 100 mA 117 mW 5 V (IR = 10 A) 130C -40C to +80C -40C to +100C
Electrical /Optical Characteristics Table TA = 25C
Parameter Forward Voltage Blue (d = 470 nm) Green (d = 525 nm) Reverse Voltage Capacitance Blue (d = 470 nm) Green (d = 525 nm) Thermal Resistance Viewing Angle Major Axis Minor Axis Peak Wavelength Blue (d = 470 nm) Green (d = 525 nm) Spectral Halfwidth Blue (d = 470 nm) Green (d = 525 nm) Luminous Efficacy Blue (d = 470 nm) Green (d = 525 nm) Symbol VF VR C RJ-PIN 21/2 5 40 240 100 40 467 520 24 35 75 520 pF C/W deg Min. Typ. 3.2 3.2 Max. 3.7 3.9 Units V Test Conditions IF = 20 mA IR = 10 A VF = 0, f = 1 MHz LED Junction-to-Cathode Lead
P
nm
Peak of Wavelength of Spectral Distribution at IF = 20 mA Wavelength Width at Spectral Distribution Power Point at IF = 20 mA Emitted luminous power/Emitted radiant power
1/2
nm
v
lm/W
Notes: 1. 21/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/v where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt.
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1.0
RELATIVE LUMINOUS INTENSITY
BLUE 0.8
GREEN
0.6
0.4
0.2 0
400
450
500
550 WAVELENGTH - nm
600
650
700
Figure 1. Relative intensity vs. wavelength.
1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30
MAXIMUM FORWARD CURRENT - mA
1.4
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
35 30 25 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE - C
FORWARD CURRENT - mA
Figure 2. Relative luminous intensity vs. forward current.
Figure 3. Forward current vs. ambient temperature.
RELATIVE DOMINANT WAVELENGTH
30
1.035 1.030 1.025 1.020 1.015 1.010 1.005 1.000 0.995 0.990 0.985 0 5 10 15 20 25 30 BLUE GREEN
FORWARD CURRENT - mA
25 20 15 10 5 0
0
0.5 1.0 1.5
2.0
2.5 3.0 3.5 4.0
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
Figure 4. Forward current vs. forward voltage.
Figure 5. Relative dominant wavelength vs. forward current.
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1.0
RELATIVE INTENSITY
0.5
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE - DEGREES
Figure 6. Spatial radiation pattern - minor axis.
1.0
RELATIVE INTENSITY
0.5
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE - DEGREES
Figure 7. Spatial radiation pattern - major axis.
Intensity Bin Limits (mcd @ 20 mA)
Bin Name F G H J K L M N P Q R Min. 110 140 180 240 310 400 520 680 880 1150 1500 Max. 140 180 240 310 400 520 680 880 1150 1500 1900
Tolerance will be 15% of these limits.
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Green Color Bin Table
Bin 1 2 3 4 5 Min. Dom. 520.0 524.0 528.0 532.0 536.0 Max. Dom. 524.0 528.0 532.0 536.0 540.0 Xmin. 0.0743 0.1650 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469 Ymin. 0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213 Xmax. 0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296 Ymax. 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543
Tolerance for each bin limit is 0.5 nm
Blue Color Bin Table
Bin 1 2 3 4 5 Min. Dom. 460.0 464.0 468.0 472.0 476.0 Max. Dom. 464.0 468.0 472.0 476.0 480.0 Xmin. 0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517 Ymin. 0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423 Xmax. 0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913 Ymax. 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327
Tolerance for each bin limit is 0.5 nm
Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information.
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Avago Color Bin on CIE Chromaticity Diagram
CIE 1931 - Chromaticity Diagram 1.000
0.800 Green
1 23 45
0.600 Y 0.400
0.200
5 4 3 2 1
Blue
0.000 0.000
0.200
0.400 X
0.600
0.800
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Relative Light Output vs. Junction Temperature
1.2 BLUE RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25C) 1.0 0.8 0.6 0.4 0.2 0 -40 GREEN
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE - C
Precautions: Lead Forming
* The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.
Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250 C. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination.
Soldering Conditions
* Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. Manual Solder Dipping - - 260 C Max. 5 sec Max.
Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time
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Avago Technologies LED Configuration
CATHODE
Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder.
* If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. * Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability.
* Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on soldering LED components.
* Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching.
TURBULENT WAVE 250
LAMINAR WAVE HOT AIR KNIFE
200 TEMPERATURE - C
TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD
150 FLUXING 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C 5C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 LEAD SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 40 50 TIME - SECONDS 60 70 80 90 100
50 30 PREHEAT 0 10 20 30
Figure 8. Recommended wave soldering profile.
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Ammo Packs Drawing
6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394)
CATHODE
20.5 1.00 (0.8071 0.0394)
9.125 0.625 (0.3593 0.025) 18.00 0.50 (0.7087 0.0197)
12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES).
A VIEW A-A
A
4.00 0.20 TYP. (0.1575 0.0079)
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff.
Packaging Box Ammo Packs
LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARDS.
A
+ O AN
DE
TE
ANODE LEAD LEAVES THE BOX FIRST.
O AG ES AV LOGI DE NO HO - CH AT
C
C
L BE LA ER TH MO
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
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DISCLAIMER AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4145EN AV02-0206EN March 20, 2007
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